Teledyne e2v HiRel and Integra Technologies Inc. Partner on High Voltage GaN Devices
MILPITAS, Calif.–(BUSINESS WIRE)–Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced a new high reliability partnership with California-based Integra Technologies, Inc. (Integra). Under the new agreement, Teledyne will leverage Integra’s portfolio of GaN on SiC RF power transistor products to deliver optimized power solutions for the space market.
With Integra, Teledyne e2v HiRel will specialize in providing high power RF devices for emerging space applications in the LEO and GEO payload market. Teledyne will also offer high reliability options for Integra’s popular GaN on SiC power devices and pallets targeted at the defense market.
“Our space customers are…