April 14, 2021
Business News

Teledyne e2v HiRel and Integra Technologies Inc. Partner on High Voltage GaN Devices


MILPITAS, Calif.–()–Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced a new high reliability partnership with California-based Integra Technologies, Inc. (Integra). Under the new agreement, Teledyne will leverage Integra’s portfolio of GaN on SiC RF power transistor products to deliver optimized power solutions for the space market.

With Integra, Teledyne e2v HiRel will specialize in providing high power RF devices for emerging space applications in the LEO and GEO payload market. Teledyne will also offer high reliability options for Integra’s popular GaN on SiC power devices and pallets targeted at the defense market.

“Our space customers are…



Click here to view the original article.

Related Posts

You might also like ...

Spark NZ Selects Calabrio as Part of Unified Front Line Initiative
AlixPartners Disruption Index Reveals That Business Leaders Don’t Consider COVID-19 to Be the Most Disruptive Force Impacting Their Organization
Germany’s Supreme Court Rules in Solvay’s Favor on Patent Case With Neo